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Rf Engineer Ii's H1B Salary 2023

28 records was found, Median Salary is $92789.45. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 29 percents of the salary are between $100K and $150K, 71 percents of the salary are less than $100k



<100k71.428571428571% Complete (success)
100k-150k28.571428571429% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
GLOBAL TECHNOLOGY ASSOCIATES LLCRF ENGINEER II72,280GLEN ALLEN, VA07/20/202309/11/2023
DISH WIRELESS LLCRF ENGINEER II81,224OKLAHOMA CITY, OK01/06/202302/06/2023
ENGINEERING WIRELESS SERVICES LLCRF ENGINEER II81,307AUSTIN, AZ07/18/202307/24/2023
ENGINEERING WIRELESS SERVICES LLCRF ENGINEER II81,307AUSTIN, TX05/18/202305/28/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II83,900NEW YORK, NY04/21/202310/01/2023
DISH WIRELESS LLCRF ENGINEER II83,990PLANO, TX03/23/202304/10/2023
DISH WIRELESS LLCRF ENGINEER II85,758BEAVERTON, OR12/06/202304/26/2024
GLOBAL TECHNOLOGY ASSOCIATES LLCRF ENGINEER II88,816EULESS, TX03/22/202304/17/2023
DISH WIRELESS LLCRF ENGINEER II89,003ORLANDO, FL09/20/202310/09/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II90,000BURTONSVILLE, MD04/12/202310/01/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II90,512HOUSTON, TX06/28/202309/01/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II91,250HACKENSACK, NJ05/24/202309/30/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II92,000PLANO, TX12/08/202312/18/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II92,187PLANO, TX10/19/202301/25/2024
DISH WIRELESS LLCRF ENGINEER II93,392OVERLAND PARK, KS06/22/202307/10/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II93,900JAMAICA, NY08/17/202308/28/2023
DISH WIRELESS LLCRF ENGINEER II94,432OKLAHOMA, OK04/19/202306/12/2023
FURTHER LLCRF ENGINEER II95,000COLUMBIA, SC06/05/202306/12/2023
DISH WIRELESS LLCRF ENGINEER II96,803HORSHAM, PA06/22/202307/10/2023
DISH WIRELESS LLCRF ENGINEER II99,840CHARLOTTE, NC12/01/202304/01/2024
DISH WIRELESS LLCRF ENGINEER II104,562SAN DIEGO, CA06/03/202310/01/2023
MOBILE COMMUNICATIONS AMERICA INCRF ENGINEER II105,000SAN ANTONIO, TX01/24/202302/20/2023
DISH WIRELESS LLCRF ENGINEER II105,893LITTLETON, CO09/21/202310/16/2023
DISH WIRELESS LLCRF ENGINEER II109,470AUSTIN, TX09/13/202309/25/2023
DISH WIRELESS LLCRF ENGINEER II109,470AUSTIN, TX09/07/202309/25/2023
DISH WIRELESS LLCRF ENGINEER II109,470AUSTIN, TX09/06/202309/25/2023
NEXTGEN GLOBAL RESOURCES LLCRF ENGINEER II110,240SAMMAMISH, WA10/23/202311/01/2023
TELEWORLD SOLUTIONS INCRF ENGINEER II112,750COLUMBUS, OH05/17/202309/30/2023

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Mar 2024
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