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10 records was found, Median Salary is $98500.09. 0 percents of the salary are above $200K, 10 percents of the salary are between $150K and $200K, 40 percents of the salary are between $100K and $150K, 50 percents of the salary are less than $100k
EMPLOYER | JOB TITLE | BASE SALARY | LOCATION | SUBMIT DATE | START DATE |
---|---|---|---|---|---|
TOKYO ELECTRON AMERICA INC | DIRECTOR, PROCESS INTEGRATION | 170,676 | BOISE, ID | 06/30/2021 | 12/30/2021 |
TOKYO ELECTRON AMERICA INC | ENGINEER, PROCESS III | 105,000 | BOISE, ID | 02/13/2023 | 08/15/2023 |
TOKYO ELECTRON AMERICA INC | ENGINEER, PROCESS, SENIOR | 122,245 | BOISE, ID | 04/06/2023 | 10/01/2023 |
TOKYO ELECTRON AMERICA INC | MANAGER I, PROCESS ENGINEERING | 109,456 | BOISE, ID | 07/31/2018 | 01/01/2019 |
TOKYO ELECTRON AMERICA INC | MANAGER, PROCESS ENGINEERING | 131,338 | BOISE, ID | 08/02/2018 | 01/01/2019 |
TOKYO ELECTRON AMERICA INC | PROCESS ENGINEER | 82,000 | BOISE, ID | 06/04/2019 | 07/01/2019 |
TOKYO ELECTRON AMERICA INC | PROCESS ENGINEER | 90,000 | BOISE, ID | 04/08/2016 | 04/25/2016 |
TOKYO ELECTRON AMERICA INC | PROCESS ENGINEER | 92,000 | BOISE, ID | 04/06/2020 | 10/01/2020 |
TOKYO ELECTRON AMERICA INC | PROCESS ENGINEER II | 72,000 | BOISE, ID | 03/01/2016 | 08/30/2016 |
TOKYO ELECTRON AMERICA INC | PROCESS ENGINEER II | 72,363 | BOISE, ID | 02/23/2017 | 08/12/2017 |
This website indexes the Labor Condition
Application (LCA)
disclosure data from the United States
Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.