Search Salary Now

Trending now: Meta, Amazon, Apple, Netflix, Google, Airbnb, Uber, Linkedin, Salesforce

Engineer Iii @ Samsung's H1B Salary 2023

19 records was found, Median Salary is $150000. 0 percents of the salary are above $200K, 68 percents of the salary are between $150K and $200K, 32 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k31.578947368421% Complete (success)
150k-200k68.421052631579% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
SAMSUNG ELECTRONICS AMERICA INCENGINEER III150,000PLANO, TX02/27/202303/10/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III150,000PLANO, TX03/01/202303/10/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, BACK-END SERVER167,149MOUNTAIN VIEW, CA05/25/202307/17/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, BACK-END SERVER175,000NEW YORK, NY02/08/202302/15/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING150,000MOUNTAIN VIEW, CA04/28/202305/12/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING183,310MOUNTAIN VIEW, CA04/11/202310/01/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING183,310MOUNTAIN VIEW, CA04/13/202310/01/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, DATA ENGINEERING187,000MOUNTAIN VIEW, CA07/20/202308/03/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, EQUIPMENT ELECTRONIC DESIGN137,987PLANO, TX06/29/202310/01/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING150,000PLANO, TX01/17/202301/31/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE ANALYSIS ENGINEERING155,000BURTONSVILLE, MD02/10/202302/24/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING139,464PLANO, TX08/01/202309/11/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA04/21/202306/05/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING167,149MOUNTAIN VIEW, CA06/13/202307/10/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SOFTWARE PROCESS ENGINEERING167,149MOUNTAIN VIEW, CA06/13/202307/10/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM EVALUATION143,000PLANO, TX08/08/202310/01/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN115,918PLANO, TX01/31/202303/13/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN131,685PLANO, TX01/09/202302/06/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER III, SYSTEM STRUCTURE DESIGN155,000PLANO, TX01/06/202301/23/2023

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
Copyright @ h1bdata.info. All rights reserved.
Contact us     Privacy policy     Advertise