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Engineer Ii, Software Process Engineering @ Samsung's H1B Salary all years

18 records was found, Median Salary is $135825. 0 percents of the salary are above $200K, 11 percents of the salary are between $150K and $200K, 89 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k88.888888888889% Complete (success)
150k-200k11.111111111111% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING110,000PLANO, TX06/06/201906/24/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING115,000PLANO, TX05/05/202110/01/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING115,000PLANO, TX05/05/202110/01/2021
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING120,000BELLEVUE, WA03/05/201909/02/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING120,000BELLEVUE, WA11/16/202101/03/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING125,000MOUNTAIN VIEW, CA09/14/202310/01/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING127,338BELLEVUE, WA12/29/202201/23/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING130,000BELLEVUE, WA08/02/201908/08/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING132,000RICHARDSON, TX08/09/201808/21/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING139,650BELLEVUE, WA04/09/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000MOUNTAIN VIEW, CA10/26/201811/01/2018
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000MOUNTAIN VIEW, CA08/01/201908/07/2019
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING140,000BELLEVUE, WA05/04/202010/01/2020
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA09/21/202211/14/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA10/19/202201/04/2023
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING148,013BELLEVUE, WA09/21/202211/14/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING150,000MOUNTAIN VIEW, CA11/14/202211/24/2022
SAMSUNG ELECTRONICS AMERICA INCENGINEER II, SOFTWARE PROCESS ENGINEERING165,000MOUNTAIN VIEW, CA04/29/202010/01/2020

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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