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Staff Packaging Engineer @ Qualcomm Technologies Inc's H1B Salary 2023

25 records was found, Median Salary is $143600. 0 percents of the salary are above $200K, 4 percents of the salary are between $150K and $200K, 96 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k96% Complete (success)
150k-200k4% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER111,925SAN DIEGO, CA11/13/201504/29/2016
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER111,925SAN DIEGO, CA01/08/201607/05/2016
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA10/04/202204/01/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA03/04/202206/01/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA03/07/202206/01/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600AUSTIN, TX08/23/202208/23/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA08/29/202208/31/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA08/26/202208/31/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA08/30/202208/31/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600IRVINE, CA09/01/202209/06/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA09/02/202209/06/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN MARCOS, CA06/06/202209/14/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER143,600SAN DIEGO, CA06/07/202206/13/2022
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA09/08/202303/07/2024
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA11/21/202205/17/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000POWAY, CA01/12/202307/12/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA01/13/202307/12/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA01/23/202307/14/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA01/26/202307/28/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA02/10/202307/14/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA05/29/202310/01/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA06/01/202310/01/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA06/08/202310/01/2023
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER144,000SAN DIEGO, CA08/23/202302/22/2024
QUALCOMM TECHNOLOGIES INCSTAFF PACKAGING ENGINEER153,200MILPITAS, CA08/17/202208/23/2022

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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