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Firmware Engineer @ Intel Mobile Communications's H1B Salary 2016

6 records was found, Median Salary is $108981.5. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 83 percents of the salary are between $100K and $150K, 17 percents of the salary are less than $100k



<100k16.666666666667% Complete (success)
100k-150k83.333333333333% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER86,650SAN DIEGO, CA10/21/201603/06/2017
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER100,464SAN DIEGO, CA09/30/201601/28/2017
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER100,464SAN DIEGO, CA11/08/201605/01/2017
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER117,499SAN DIEGO, CA12/14/201605/13/2017
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER117,499SAN DIEGO, CA07/19/201607/25/2016
INTEL MOBILE COMMUNICATIONSFIRMWARE ENGINEER118,522SANTA CLARA, CA11/21/201605/16/2017

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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