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12 records was found, Median Salary is $99736. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 50 percents of the salary are between $100K and $150K, 50 percents of the salary are less than $100k
| EMPLOYER | JOB TITLE | BASE SALARY | LOCATION | SUBMIT DATE | START DATE |
|---|---|---|---|---|---|
| HP INC | DATA ENGINEER 5 | 111,571 | CORVALLIS, OR | 05/05/2023 | 11/03/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 86,923 | CORVALLIS, OR | 03/16/2023 | 08/08/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER VI | 117,104 | CORVALLIS, OR | 03/06/2023 | 06/25/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 96,387 | CORVALLIS, OR | 03/07/2023 | 08/23/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 97,448 | CORVALLIS, OR | 08/04/2023 | 10/01/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 102,024 | CORVALLIS, OR | 01/23/2023 | 07/13/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 102,024 | CORVALLIS, OR | 01/23/2023 | 07/17/2023 |
| HP INC | ELECTRICAL HARDWARE ENGINEER | 102,024 | CORVALLIS, OR | 01/25/2023 | 07/20/2023 |
| HP INC | ENGINEER | 95,306 | CORVALLIS, OR | 02/07/2023 | 07/31/2023 |
| HP INC | MANAGER ELECTRICAL HARDWARE ENGINEERING II | 115,814 | CORVALLIS, OR | 03/16/2023 | 09/04/2023 |
| HP INC | MANUFACTURING SOFTWARE ENGINEER | 62,358 | CORVALLIS, OR | 01/13/2023 | 07/10/2023 |
| HP INC | SOFTWARE DEV OPS ENGINEER 4 | 81,682 | CORVALLIS, OR | 05/05/2023 | 10/07/2023 |
This website indexes the Labor Condition
Application (LCA)
disclosure data from the United States
Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.
