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Vice President, Lead Software Engineer's H1B Salary 2023

17 records was found, Median Salary is $136500. 0 percents of the salary are above $200K, 35 percents of the salary are between $150K and $200K, 65 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k64.705882352941% Complete (success)
150k-200k35.294117647059% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER129,200COLUMBUS, OH08/17/202301/13/2024
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER130,000COLUMBUS, OH08/24/202301/27/2024
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER131,700COLUMBUS, OH06/15/202311/13/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER131,700COLUMBUS, OH08/28/202311/13/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER135,000COLUMBUS, OH05/03/202306/05/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER135,000COLUMBUS, OH02/16/202308/15/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER135,000COLUMBUS, OH05/08/202310/23/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER135,000COLUMBUS, OH05/10/202310/02/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER136,500COLUMBUS, OH09/07/202303/05/2024
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER145,000COLUMBUS, OH09/15/202310/09/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER149,900COLUMBUS, OH05/23/202310/29/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER150,000COLUMBUS, OH03/10/202309/06/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER152,500COLUMBUS, OH09/19/202301/25/2024
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER155,000COLUMBUS, OH06/06/202308/08/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER155,000COLUMBUS, OH06/09/202307/01/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER158,438COLUMBUS, OH04/13/202305/01/2023
JPMORGAN CHASE & COVICE PRESIDENT, LEAD SOFTWARE ENGINEER160,000COLUMBUS, OH05/22/202307/10/2023

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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