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Firmware Engineer @ Microchip Technology Inc's H1B Salary 2023

7 records was found, Median Salary is $97302. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 43 percents of the salary are between $100K and $150K, 57 percents of the salary are less than $100k



<100k57.142857142857% Complete (success)
100k-150k42.857142857143% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER87,152ROSEVILLE, CA04/15/201904/26/2019
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER88,691SAN JOSE, CA08/21/201902/17/2020
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER97,302SUNNYVALE, CA03/16/202009/12/2020
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER97,302SUNNYVALE, CA03/16/202009/12/2020
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER100,339ROSEVILLE, CA11/02/202104/27/2022
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER106,371CHANDLER, AZ12/01/202012/14/2020
MICROCHIP TECHNOLOGY INCFIRMWARE ENGINEER117,291SAN JOSE, CA02/26/202108/20/2021

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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