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R&d Engineer Ic Design Iii @ Broadcom Corporation's H1B Salary 2023

5 records was found, Median Salary is $98136.11. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 40 percents of the salary are between $100K and $150K, 60 percents of the salary are less than $100k



<100k60% Complete (success)
100k-150k40% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BROADCOM CORPORATIONR&D ENGINEER IC DESIGN III94,612IRVINE, CA04/08/201609/05/2016
BROADCOM CORPORATIONR&D ENGINEER IC DESIGN III97,867SUNNYVALE, CA04/08/201609/12/2016
BROADCOM CORPORATIONR&D ENGINEER IC DESIGN III98,136IRVINE, CA04/08/201609/30/2016
BROADCOM CORPORATIONR&D ENGINEER IC DESIGN III103,193IRVINE, CA04/08/201609/05/2016
BROADCOM CORPORATIONR&D ENGINEER IC DESIGN III106,328IRVINE, CA04/08/201609/05/2016

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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