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R&d Engineer Firmware @ Broadcom Corporation's H1B Salary 2023

3 records was found, Median Salary is $188700. 0 percents of the salary are above $200K, 100 percents of the salary are between $150K and $200K, 0 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k0% Complete (success)
150k-200k100% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE155,397SAN DIEGO, CA01/17/202307/15/2023
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE188,700SAN JOSE, CA08/25/202309/05/2023
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE192,941SAN JOSE, CA05/10/202306/15/2023

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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