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Vice President, Software Engineering's H1B Salary 2021

25 records was found, Median Salary is $134000. 0 percents of the salary are above $200K, 4 percents of the salary are between $150K and $200K, 96 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k96% Complete (success)
150k-200k4% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING109,200COLUMBUS, OH05/11/202109/11/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING112,500COLUMBUS, OH02/16/202106/30/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING113,000COLUMBUS, OH08/09/202101/29/2022
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING113,000COLUMBUS, OH12/15/202105/05/2022
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING118,500COLUMBUS, OH04/26/202106/04/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING120,000COLUMBUS, OH02/18/202106/15/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING120,500COLUMBUS, OH07/07/202111/20/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING123,500COLUMBUS, OH04/05/202109/20/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING125,000COLUMBUS, OH01/06/202101/25/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING126,100COLUMBUS, OH04/19/202106/15/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING131,000COLUMBUS, OH03/09/202104/03/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING131,700COLUMBUS, OH08/24/202101/28/2022
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING134,000COLUMBUS, OH04/29/202110/29/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,000COLUMBUS, OH04/29/202108/10/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,000COLUMBUS, OH05/03/202109/29/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,000COLUMBUS, OH02/16/202103/15/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,400COLUMBUS, OH04/26/202106/07/2021
JP MORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING135,400COLUMBUS, OH03/05/202106/07/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING136,200COLUMBUS, OH02/19/202108/06/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING139,000COLUMBUS, OH10/22/202104/09/2022
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING139,200COLUMBUS, OH02/17/202106/09/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING140,000COLUMBUS, OH08/31/202110/25/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING141,200COLUMBUS, OH04/16/202110/08/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING143,000COLUMBUS, OH05/18/202110/15/2021
JPMORGAN CHASE & COVICE PRESIDENT, SOFTWARE ENGINEERING155,000COLUMBUS, OH05/28/202110/29/2021

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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