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Firmware Engineer's H1B Salary 2018

7 records was found, Median Salary is $101109. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 57 percents of the salary are between $100K and $150K, 43 percents of the salary are less than $100k



<100k42.857142857143% Complete (success)
100k-150k57.142857142857% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
INTEL CORPORATIONFIRMWARE ENGINEER86,195HILLSBORO, OR04/06/201810/01/2018
INTEL CORPORATIONFIRMWARE ENGINEER87,339HILLSBORO, OR09/26/201803/25/2019
INTEL CORPORATIONFIRMWARE ENGINEER91,874HILLSBORO, OR12/06/201812/12/2018
INTEL CORPORATIONFIRMWARE ENGINEER101,109HILLSBORO, OR03/01/201808/25/2018
INTEL CORPORATIONFIRMWARE ENGINEER105,754HILLSBORO, OR09/14/201809/20/2018
INTEL CORPORATIONFIRMWARE ENGINEER107,640HILLSBORO, OR10/25/201810/30/2018
INTEL CORPORATIONFIRMWARE ENGINEER116,002HILLSBORO, OR03/13/201809/11/2018

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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