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Firmware Engineer's H1B Salary 2023

8 records was found, Median Salary is $110177.5. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 63 percents of the salary are between $100K and $150K, 38 percents of the salary are less than $100k



<100k37.5% Complete (success)
100k-150k62.5% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
INTEL CORPORATIONFIRMWARE ENGINEER98,842HILLSBORO, OR01/06/202306/28/2023
INTEL CORPORATIONFIRMWARE ENGINEER98,842HILLSBORO, OR03/01/202308/16/2023
INTEL CORPORATIONFIRMWARE ENGINEER98,842HILLSBORO, OR03/04/202308/28/2023
INTEL CORPORATIONFIRMWARE ENGINEER101,670HILLSBORO, OR09/01/202310/01/2023
INTEL CORPORATIONFIRMWARE ENGINEER118,685HILLSBORO, OR02/03/202307/18/2023
INTEL CORPORATIONFIRMWARE ENGINEER118,685HILLSBORO, OR03/09/202309/02/2023
INTEL CORPORATIONFIRMWARE ENGINEER123,677HILLSBORO, OR07/21/202301/17/2024
INTEL CORPORATIONFIRMWARE ENGINEER138,528HILLSBORO, OR03/02/202308/22/2023

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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