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Design Engineer's H1B Salary 2023

27 records was found, Median Salary is $73278. 0 percents of the salary are above $200K, 0 percents of the salary are between $150K and $200K, 0 percents of the salary are between $100K and $150K, 100 percents of the salary are less than $100k



<100k100% Complete (success)
100k-150k0% Complete (success)
150k-200k0% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BFE ACQUISITION SUB II LLCDESIGN ENGINEER68,440COLORADO SPRINGS, CO02/14/201808/11/2018
BFE ACQUISITION SUB II LLCDESIGN ENGINEER81,140COLORADO SPRINGS, CO05/07/202108/11/2021
BFE ACQUISITION SUB II LLCDESIGN ENGINEER82,720COLORADO SPRINGS, CO05/07/202108/11/2021
BFE ACQUISITION SUB II LLCDESIGN ENGINEER82,720COLORADO SPRINGS, CO05/07/202108/11/2021
HCDA ENGINEERING INCDESIGN ENGINEER54,080COLORADO SPRINGS, CO02/23/201608/24/2016
HCDA ENGINEERING INCDESIGN ENGINEER55,640COLORADO SPRINGS, CO02/26/201608/27/2016
HCDA ENGINEERING INCDESIGN ENGINEER55,640COLORADO SPRINGS, CO03/01/201608/27/2016
HCDA ENGINEERING INCDESIGN ENGINEER65,520COLORADO SPRINGS, CO07/03/201908/27/2019
HCDA ENGINEERING INCDESIGN ENGINEER65,520COLORADO SPRINGS, CO07/18/201908/27/2019
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER67,309COLORADO SPRINGS, CO10/24/201911/01/2019
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER67,309COLORADO SPRINGS, CO03/06/202009/01/2020
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER67,309COLORADO SPRINGS, CO03/06/202009/01/2020
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER67,309COLORADO SPRINGS, CO10/24/201911/01/2019
ROUNDTABLE ENGINEERING SOLUTIONS LLCDESIGN ENGINEER70,000COLORADO SPRINGS, CO02/13/202002/17/2020
ROUNDTABLE ENGINEERING SOLUTIONS LLCDESIGN ENGINEER72,000COLORADO SPRINGS, CO02/15/202108/15/2021
ROUNDTABLE ENGINEERING SOLUTIONS LLCDESIGN ENGINEER72,000COLORADO SPRINGS, CO02/18/202108/15/2021
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER73,278COLORADO SPRINGS, CO09/02/202110/01/2021
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER73,278COLORADO SPRINGS, CO09/02/202110/01/2021
LINEAR TECHNOLOGY CORPORATIONDESIGN ENGINEER77,000COLORADO SPRINGS, CO03/09/201709/07/2017
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER79,498COLORADO SPRINGS, CO03/05/201908/21/2019
ANALOG DEVICES INCDESIGN ENGINEER85,000COLORADO SPRINGS, CO03/01/201908/28/2019
GRAPHENE INCDESIGN ENGINEER85,000COLORADO SPRINGS, CO03/21/201604/01/2016
MICROCHIP TECHNOLOGY INCDESIGN ENGINEER86,778COLORADO SPRINGS, CO08/15/201702/06/2018
LINEAR TECHNOLOGY LLCDESIGN ENGINEER90,000COLORADO SPRINGS, CO03/12/201809/08/2018
LINEAR TECHNOLOGY CORPORATIONDESIGN ENGINEER90,000COLORADO SPRINGS, CO02/15/201608/11/2016
ANALOG DEVICES INCDESIGN ENGINEER90,000COLORADO SPRINGS, CO03/19/201909/18/2019
ANALOG DEVICES INCDESIGN ENGINEER90,614COLORADO SPRINGS, CO03/01/202208/06/2022

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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