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R&d Engineer Firmware 5 @ Broadcom Corporation's H1B Salary 2023

7 records was found, Median Salary is $121982.38. 0 percents of the salary are above $200K, 14 percents of the salary are between $150K and $200K, 86 percents of the salary are between $100K and $150K, 0 percents of the salary are less than $100k



<100k0% Complete (success)
100k-150k85.714285714286% Complete (success)
150k-200k14.285714285714% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5105,040SAN DIEGO, CA01/16/201807/09/2018
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5120,578AUSTIN, TX12/13/201701/04/2018
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5121,937SAN DIEGO, CA04/19/201609/30/2016
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5121,982SANTA CLARA, CA03/10/201609/03/2016
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5122,200SAN DIEGO, CA03/03/201608/27/2016
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5137,818SAN DIEGO, CA04/06/201608/03/2016
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE 5167,368SAN JOSE, CA03/07/201706/09/2017

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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