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R&d Engineer Firmware @ Broadcom Corporation's H1B Salary 2023

7 records was found, Median Salary is $124654. 0 percents of the salary are above $200K, 29 percents of the salary are between $150K and $200K, 57 percents of the salary are between $100K and $150K, 14 percents of the salary are less than $100k



<100k14.285714285714% Complete (success)
100k-150k57.142857142857% Complete (success)
150k-200k28.571428571429% Complete (warning)
>200k0% Complete (danger)
EMPLOYERJOB TITLEBASE SALARYLOCATIONSUBMIT DATESTART DATE
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE85,925SAN DIEGO, CA02/22/201808/02/2018
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE104,770SAN DIEGO, CA02/06/201907/28/2019
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE104,770SAN DIEGO, CA02/11/201907/28/2019
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE124,654SAN DIEGO, CA03/08/201908/03/2019
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE127,920SAN DIEGO, CA01/24/202007/17/2020
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE155,397SAN DIEGO, CA01/17/202307/15/2023
BROADCOM CORPORATIONR&D ENGINEER FIRMWARE173,176SAN DIEGO, CA04/19/202105/15/2021

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).
Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.
An LCA is used by employers as supporting evidence for the petition for an H-1B visa.
DOL disclosure data does not indicate the employer's intended use for the LCA.

Indexed more than 4.8 million records between Oct 2013 and Sep 2023
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